Glass and quartz plates and rings. Plates 240 x 240 x 2.32 mm, rings diameter 35 mm, thickness 330 microns.

Glass, germanium and ferrites plates after slicing on the AWSM wire saw machines.

Glass and quartz plates and rings. Plates 240 x 240 x 2.32 mm, rings diameter 35 mm, thickness 330 microns.

Silicon wafers for PV applications. PSQ wafers 102.5 x 102.5 mm, thickness 330 microns, multi-crystalline wafers 125 x 100 mm, thickness 240 microns.

Single crystal as cut Si wafers / diameter from 2" to 14", thickness 140 to 810 microns.

Different Si as cut wafers for PV application.

Quartz rings - as cut, thickness 330 microns.

PV single crystal wafers, 156 x 156 mm, thickness 240 microns in technological cassettes.

PV single crystal wafers, 156 x 156 mm, thickness 240 microns in PE box